Huawei Technologies said in regulatory filings on Wednesday that it plans to issue two tranches of 3 billion yuan (US$422 million) bonds, each with three-year maturities.
Huawei plans 6 billion yuan bond issue – prospectus
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Huawei Technologies said in regulatory filings on Wednesday that it plans to issue two tranches of 3 billion yuan (US$422 million) bonds, each with three-year maturities.
