Huawei Technologies said in regulatory filings on Wednesday that it plans to issue two tranches of 3 billion yuan (US$422 million) bonds, each with three-year maturities.
Huawei plans 6 billion yuan bond issue – prospectus
Huawei Technologies said in regulatory filings on Wednesday that it plans to issue two tranches of 3 billion yuan (US$422 million) bonds, each with three-year maturities.